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Notiziario Marketpress di Lunedě 01 Marzo 2010
 
   
  TELCO COMPLETED THE ISSUE OF A €1.3BN BOND

 
   
  Milano, 1 March 2010 - Friday February 26 th Telco completed the issue of a €1.3bn bond, subscribed for pro-rata by its shareholders. The proceeds have been used to reimburse in full the approx. €0.9bn bridge loan granted by shareholders Telefonica, Intesa Sanpaolo and Mediobanca, and the approx. €0.4bn bank bridge loan granted by Intesa Sanpaolo and Mediobanca. The company’s bank debt therefore has been reduced to €2.1bn.  
   
 

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